Added old firmware and pcb design files

These are all design documents that I thought I had lost. It's may make
me cringe, but it's still cool to use it to see how far I've come.
This commit is contained in:
2016-05-12 20:04:43 -07:00
parent a4df0d921d
commit b300c76103
1047 changed files with 379298 additions and 0 deletions

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=======================================================================
3D PCB Viewer - Version 2011.0.433.780
=======================================================================
Job Directory: C:\Users\corwin\Google Drive\_Work Related\SARL\PCB Design\Mega2560DriverBoard\
Design Status Report: C:\Users\corwin\Google Drive\_Work Related\SARL\PCB Design\Mega2560DriverBoard\Mega2560DriverBoard_PCB\3D\LogFiles\DesignStatus3D_00.txt
Fri Dec 13 10:44:55 2013
=======================================================================
DESIGN STATUS
=======================================================================
Board Size Extents ............ 0 X 0 (mm)
Actual Board Area ............. 0 (mm)
Pins .......................... 0
Layers ........................ 2
Layer 1
Trace Widths .......... None.
Layer 2
Trace Widths .......... None.
Nets received ... 0
Nets used in 3DViewer .......... 0
Nets not used .................. 0
Trace Widths Used (mm) ........
Vias .......................... 0
Parts Placed .................. 79
Parts Mounted on Top ...... 79
SMD ................... 49
Through ............... 30
Test Points ........... 0
Mechanical ............ 0
Parts Mounted on Bottom ... 0
SMD ................... 0
Through ............... 0
Test Points ........... 0
Mechanical ............ 0
Embedded Components ........ 0
RF Shapes .................. 0
Edge Connector Parts ...... 0
Parts not Placed .............. 0
Parts not shown in viewer ...... 0
Jumpers ....................... 0
Through Holes ................. 163
Mounting Holes ................ 0
Part Packages .................. 42
Padstack instances ............. 20
Padstack names ................. 20
Physical Stackup
................................ thk ........ elevation
SM Top .................... No Solder Mask
Top Component Elevation .................. 0.323
Insulator Layer ......... 0.000 ...... 0.323
Conductive Layer 1 ........ 0.034 ...... 0.323
Insulator Layer ......... 0.254 ...... 0.288
Conductive Layer 2 ........ 0.034 ...... 0.034
Insulator Layer ......... 0.000 ...... 0.000
Bottom Component Elevation ............... 0.000
SM Bottom ................. No Solder Mask
total ................ 0.323

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IconResource=C:\Users\Corwin\AppData\Roaming\Insync\App\res\shared-folder-vista-7.ico,0

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[.ShellClassInfo]
IconResource=C:\Users\Corwin\AppData\Roaming\Insync\App\res\shared-folder-vista-7.ico,0